Jarvis to advance nanometer-scale X-ray CT microscopy

| NBNTV = Ju Hyeon-ung | Jarvis, a company specializing in X-ray inspection equipment, is embarking on the advancement of X-ray CT microscopy technology with nanometer resolution.

This technological development aims to observe micro-cracks within identical materials, which have been difficult to inspect during advanced semiconductor packaging and secondary battery manufacturing processes.

Micro-cracks occurring within the same material are difficult to identify using existing inspection methods due to minimal differences in X-ray transmittance. Jarvis has identified micro-cracks in semiconductor glass substrate Through-Silicon Via (TGV) structures and electrode active material particle cracks during secondary battery charging and discharging as its primary application areas.

Nanometer-scale X-ray microscopy has primarily been used for laboratory analysis due to limitations in imaging and image processing time. Jarvis is currently working to improve imaging speed while maintaining high resolution, elevating research-grade equipment to a level suitable for mass production inspection lines.

According to market research firm Verified Market Research, the global X-ray microscopy market is estimated to expand from $1.73 billion in 2023 to $3.66 billion by 2030.

A representative from Jarvis stated, "Making the invisible visible is the reason for an X-ray inspection equipment company's existence," adding, "Micro-cracks within the same material have remained an inspection blind spot until now."

"Our goal is to simultaneously increase both resolution and speed to move nano-inspection technology from the laboratory to the production site, and to solve the problems currently being faced by semiconductor and secondary battery customers," the representative added.